SMD High Temperature Class II

10V - 2000V 150°C-250°C

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Applications

•Timing circuits
•Precision circuitry
•Filtering for High Temperature environment
•Downhole drilling
•Aerospace and automotive applications

Features

•X7R High Temperature ceramic up to 250°C
•Robust design for High Temperature durability
•ROHS Tin Termination or Non ROHS SnPb for use up to 200°C
•Gold/Silver-Palladium/Solderable Silver for use up to 250°C
•Custom voltage, package size, capacitance value on request
•168H/125°C Burn-In option for maximum reliability
•Extended range for low time usage with reasonable reliability

Electrical Parameters

ELECTRICAL CHARACTERISTICS :
at + 25°C unless otherwise specified
OPERATING TEMPERATURE :
- 55°C, + 250°C
TEMPERATURE COEFFICIENT :
± 15% with 0 Vdc applied on -55°C/125°C
for 125°C/250°C range, refer to chart
DISSIPATION FACTOR :
≤ 2.5% at 1kHz for C ≥ 100pF
INSULATION RESISTANCE (IR) :
25°C/Un 10&sup5; MOhm or 1000 Ohm·Farad whichever is less
200°C/Un 10&sup4; MOhm or 100 Ohm·Farad whichever is less
250°C/Un 5x10³ MOhm or 50 Ohm·Farad whichever is less
DIELECTRIC STRENGTH TEST :
2.5Un U≤200V | U+250V 200
for 5s with 50mA max charging current

H	0603	Y	101	J	B	W	B	D03
SERIE	SIZE	DIELECTRIC	CAPACITANCE	TOLERANCE	VOLTAGE	TERMINATION	PACKAGING	SPECIAL PARAMETERS
High-Temperature	0603 0805 1206 1210 1812 2220	Y = X7R	Expressed in picofarads (pF). The first two digits are significant, the third digit gives the number of noughts. Example: 102 = 1 000pF	J = ± 5% K = ± 10% M = ± 20%	Q = 10V J = 16V X = 25V Z = 35V A = 50V U = 63V B = 100V C = 200V P = 250V E = 500V F = 630V G = 1000V O = 1500V H = 2000V	X = Nickel Tin (up to 200°C) H = Dipped SnPb (up to 200°C) S = Dipped SAC (up to 200°C) I = Electrolytic SnPb (up to 200°C) F = Palladium-Silver (up to 250°C) W = Nickel Gold (up to 250°C) Q = Solderable Silver (up to 250°C)	B = Reel V = Bulk	- D03 = Burn-In 168H/125°C BM = BME Dxx = Reliability spec Exx = Sorting spec