fr en
Short Lead Times    Custom Designs    Made In France    No Obsolescence

Low Inductance capacitors type II


6.3V - 50V

Applications

•Typical uses : high speed energy transfer on semiconductor applications


Features

•Inverted geometry reduce the ESL up to 60% to standard MLCC
•Custom voltage, package size, capacitance value on request
•Tested in accordance to CECC 32100 and AEC-Q200
•CECC 30700 et NFC 83-132 compliant

 
Electrical Parameters

ELECTRICAL CHARACTERISTICS :
at + 25°C unless otherwise specified
OPERATING TEMPERATURE :
- 55°C, + 125°C
TEMPERATURE COEFFICIENT :
± 15% with 0Vdc applied
DISSIPATION FACTOR :
≤ 2.5% at 1kHz for C ≥ 100pF
INSULATION RESISTANCE (IR) :
25°C/Un 105 MOhm or 1000 Ohm-Farad whichever is less
125°C/Un 104 MOhm or 100 Ohm-Farad whichever is less
DIELECTRIC STRENGTH TEST :
Performed per method 103 of EIA 198-2-E
1.2Un for 5s with 50mA max charging current

Quick Reference Data

 

0204

0306

0508

0612

Min

1.0 nF

1.0 nF

1.0 nF

1.0 nF

6.3V

22 nF

220 nF

1.0 µF

1.5 µF

10V

 

150 nF

1.0 µF

1.5 µF

16V

 

68 nF

220 nF

330 nF

25V

 

22 nF

100 nF

220 nF

50V

   

100 nF

150 nF

Ordering Information

0805

Y

103

K

C

X

B

XX

SIZE

DIELECTRIC

CAPACITANCE

TOLERANCE

VOLTAGE

TERMINATION

PACKAGING

SPECIAL PARAMETERS

0204

0306

0508

0612

Y = X7R

Expressed in

picofarads (pF).

The first two digits

are significant, the

third digit give the

number of noughts.

Example :

102 = 1 000pF

J = ± 5%
K = ± 10%
M = ± 20%

R = 6.3V

Q = 10V

J = 16V

X = 25V

A = 50V

X = Nickel Tin

F = Palladium-Silver

P = Polymer Tin (Flex)

C = Copper Tin (Non magnetic)

W = Nickel Gold

H = Dipped SnPb

I = Electrolytic SnPb

B = Reel

V = Bulk

-

BM = BME

Txx = Thickness spec

Dxx = Reliabilty spec

Exx = Sorting spec

                 Cross References
 
              Downloads     
          Catalog
           SRT Simulator Tool
            Conflict minerals
            ISO
          Rohs
          Reach
         Environment