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SMD Low Voltage Class II


10V - 1000V

Applications

•Typical uses : passing, coupling, filtering, blocking


Features

•Temperature stable classe II ceramic
•Custom voltage, package size, capacitance value on request
•Tested in accordance to CECC 32100 and AEC-Q200
•CECC 30700 et NFC 83-132 compliant
•Available in stack or radial
•Wide range of termination
•All PME values available in non magnetic termination
•BX range with improved ESR and voltage coef, MIL specifications
Electrical Parameters

ELECTRICAL CHARACTERISTICS :
at + 25°C unless otherwise specified
OPERATING TEMPERATURE
- 55°C, + 125°C
TEMPERATURE COEFFICIENT :
± 15% with 0Vdc applied
BX : +15% -25% at rated voltage
DISSIPATION FACTOR :
≤ 2.5% at 1kHz for C ≥ 100pF
INSULATION RESISTANCE (IR) :
25°C/Un 105 MOhm or 1000 Ohm-Farad whichever is less
125°C/Un 104 MOhm or 100 Ohm-Farad whichever is less
DIELECTRIC STRENGTH TEST :
Performed per method 103 of EIA 198-2-E
1.2Un for 5s with 50mA max charging current

Quick Reference Data

See datasheet for more information.
Ordering Information

0805

Y

103

K

C

X

B

-

SIZE

DIELECTRIC

CAPACITANCE

TOLERANCE

VOLTAGE

TERMINATION

PACKAGING

SPECIAL PARAMETERS

0402

0504

0603

0805

1206

1210

1808

1812

1825

2220

2225

3033

3640

4040

5440

Y = X7R

X = BX

BY = 2C1

Expressed in

picofarads (pF).

The first two digits

are significant, the

third digit give the

number of noughts.

Example :

102 = 1 000pF

J = ± 5%

K = ± 10%

M = ± 20%

X = 25V

A = 50V

U = 63V

B = 100V

C = 200V

P = 250V

E = 500V

F = 630V

G = 1000V

X = Nickel Tin

F = Palladium-Silver

P = Polymer Tin (Flex)

C = Copper Tin (Non magnetic)

W = Nickel Gold

H = Dipped SnPb

I = Electrolytic SnPb

B = Reel

V = Bulk

-

BM = BME

Dxx = Reliabilty spec

Exx = Sorting spec

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